Title:
基板処理装置およびその製造方法
Document Type and Number:
Japanese Patent JP7480396
Kind Code:
B2
Abstract:
A substrate processing apparatus includes a nozzle unit. The nozzle unit includes a line and a nozzle tip provided on a tip end of the line. The line includes a first layer, a second layer and a third layer. The nozzle tip is formed of a corrosion resistant resin having conductivity. The third layer is configured to cover the first layer and the second layer from outside and cover a part of the nozzle tip from outside.
Inventors:
Yusuke Hashimoto
Jiro Higashijima
Jiro Higashijima
Application Number:
JP2023093299A
Publication Date:
May 09, 2024
Filing Date:
June 06, 2023
Export Citation:
Assignee:
東京エレクトロン株式会社
International Classes:
H01L21/304; H01L21/027
Domestic Patent References:
| JP2017050387A | ||||
| JP2011066426A | ||||
| JP2008118109A |
Foreign References:
| KR1020180126866A |
Attorney, Agent or Firm:
Manabu Miyajima
Hideyuki Mori
Hiroyuki Nagai
Hideyuki Mori
Hiroyuki Nagai