Title:
包装用の積層体及び包装袋
Document Type and Number:
Japanese Patent JP7487851
Kind Code:
B2
Abstract:
Provided is a packaging laminate 100A composed of at least 90 mass% polypropylene, said packaging laminate 100A comprising at least a substrate layer 11 that includes a first polypropylene film and a sealant layer 12 that includes a second polypropylene film, wherein: the first polypropylene film is a oriented polypropylene film; the first polypropylene film and the second polypropylene film are positioned such that the respective MDs thereof substantially match; the thermal shrinkage RMD1 in the MD of the first polypropylene film is not more than 10%; the thermal shrinkage RTD1 in the TD of the first polypropylene film is not more than 12%; and the thermal shrinkage RTD2 in the TD of the second polypropylene film is less than the thermal shrinkage RTD1 but not less than 0.5%.
Inventors:
Yasukata Ono
Yu Ogiwara
Yu Ogiwara
Application Number:
JP2023565430A
Publication Date:
May 21, 2024
Filing Date:
June 05, 2023
Export Citation:
Assignee:
TOPPAN Holdings Co., Ltd.
International Classes:
B65D65/40; B32B27/32
Domestic Patent References:
| JP2021020391A | ||||
| JP2021178974A | ||||
| JP2018089567A | ||||
| JP9290477A |
Foreign References:
| WO2019065306A1 |
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshiki Kuroki
Youhei Suzuki
Toshimasa Takabe
Yoshiki Kuroki
Youhei Suzuki
Toshimasa Takabe