Title:
【発明の名称】スピンコート被膜用拡散構造体
Document Type and Number:
Japanese Patent JPH04505525
Kind Code:
A
Abstract:
In forming integrated circuits on a wafer, diffuser features are provided adjacent to topographic features so that when a film is formed by spin-coating a liquid precursor over the integrated circuits, the action of the spreading liquid relative to the diffuser features in proximity to topographic features minimizes radial streaks which would have been caused by the topographic features.
Inventors:
Weiss Armin K
Tin Goodwin
Tin Goodwin
Application Number:
JP50489691A
Publication Date:
September 24, 1992
Filing Date:
February 04, 1991
Export Citation:
Assignee:
Eastman Kodak Company
International Classes:
G03F7/16; H01L21/027; H01L23/485; (IPC1-7): G03F7/16; H01L21/027
Attorney, Agent or Firm:
Kenji Yoshida (2 outside)