Title:
【発明の名称】電子回路装置
Document Type and Number:
Japanese Patent JPH05243433
Kind Code:
A
Abstract:
PURPOSE: To reduce the quantity of electrically connecting elements by constituting semiconductor element for power without using metal oxide ceramic. CONSTITUTION: Heat conductive paste parts 14 and 30 with a prescribed thickness and shape are provided within layer structure. Flexible foils 16 and 28 of a stable shape and heat resistance, which are produced from organic polymer and provided with a metallic thin plate, consists of multilayered structure obtained by alternately arranging foils and metal or single-layer structure and incorporates flexible conductive plates connecting two or several layers with metal by way of a metal-coated notch as a substrate depositing body and/or a connecting element 28.
Inventors:
KURISUCHIYAN GEEBURU
DEIITAA REEBUAA
DEIITAA REEBUAA
Application Number:
JP26492192A
Publication Date:
September 21, 1993
Filing Date:
October 02, 1992
Export Citation:
Assignee:
EKUSUPORUTO KONTOA AUSENHANDER
International Classes:
H01L23/36; H01L23/373; H01L23/498; (IPC1-7): H01L23/36
Attorney, Agent or Firm:
Takehisa Ito