Title:
【発明の名称】半導体チツプのダイボンデイング位置確認方法
Document Type and Number:
Japanese Patent JPH0770551
Kind Code:
B2
Inventors:
Komura Masaru
Katsumi Tomita
Katsumi Tomita
Application Number:
JP3664686A
Publication Date:
July 31, 1995
Filing Date:
February 20, 1986
Export Citation:
Assignee:
Rome Co., Ltd.
International Classes:
H01L21/52; H01L21/58; H01L21/60; (IPC1-7): H01L21/52; H01L21/60
Domestic Patent References:
| JP56129332A | ||||
| JP5887838A | ||||
| JP61131536A |
Attorney, Agent or Firm:
Koji Onishi
Next Patent: 半導体装置