Document Type and Number:
Japanese Patent JPS55161649
Kind Code:
U
More Like This:
| JP6564942 | Wafer centering equipment |
Application Number:
JP5923179U
Publication Date:
November 20, 1980
Filing Date:
May 02, 1979
Export Citation:
International Classes:
F16L23/02; B60S1/52; B60S1/54; F16L23/00; (IPC1-7): B60S1/52
Domestic Patent References:
| JPS51140928U | 1976-11-13 |
Previous Patent: JPS55161648
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