Document Type and Number:
Japanese Patent JPS5544400
Kind Code:
Y2
More Like This:
JPH0987417 | ELECTROCONDUCTIVE THIN RESIN MOLDING |
Application Number:
JP11675276U
Publication Date:
October 17, 1980
Filing Date:
August 30, 1976
Export Citation:
International Classes:
H05K9/00; H01Q17/00; (IPC1-7): H05K9/00; H01Q17/00