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Patent Searching and Data


Title:
【発明の名称】半導体装置の製造方法
Document Type and Number:
Japanese Patent JPS5923101
Kind Code:
B2
Inventors:
MORI TETSUO
ISHIHARA OSAMU
NAKATANI MASAAKI
MITSUI SHIGERU
Application Number:
JP13807277A
Publication Date:
May 30, 1984
Filing Date:
November 16, 1977
Export Citation:
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Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
H01L29/73; H01L21/28; H01L21/3205; H01L21/331; H01L23/52; H01L29/72; H01L29/78; H01L29/80; H05K3/46; (IPC1-7): H01L21/28; H01L29/80
Attorney, Agent or Firm:
Shinichi Kusano