Title:
【考案の名称】半導体集積回路
Document Type and Number:
Japanese Patent JPS5952646
Kind Code:
U
Inventors:
Kondo Shigenori
Application Number:
JP14776282U
Publication Date:
April 06, 1984
Filing Date:
September 29, 1982
Export Citation:
International Classes:
H01L23/58; G01K1/14; H01L27/00; (IPC1-7): H01L23/56; H01L27/00
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