Title:
【発明の名称】誘電性ボードの製造方法およびこれに使用するプレス板
Document Type and Number:
Japanese Patent JPS61500840
Kind Code:
A
Abstract:
PCT No. PCT/GB84/00441 Sec. 371 Date Oct. 21, 1985 Sec. 102(e) Date Oct. 21, 1985 PCT Filed Dec. 19, 1984 PCT Pub. No. WO85/02969 PCT Pub. Date Jul. 4, 1985.Copper substantially free of micro-pores is electrodeposited on a polished surface of a stainless steel, titanium, or chromium-plated steel press plate. The copper layer is then provided with a matte surface of copper of dendritic structure which is subsequently bonded to a dielectric material under the application of heat and pressure in a laminating press. The resulting copper-clad dielectric board separates from the press plate, which can then be re-used.
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Inventors:
Thorpe Jiyoung Edwin
Saran Garciyaran Shin
Saran Garciyaran Shin
Application Number:
JP50035185A
Publication Date:
May 01, 1986
Filing Date:
December 19, 1984
Export Citation:
Assignee:
M&T Lamine-Ts Limited
International Classes:
B29C70/06; B29C43/20; B32B7/02; B32B9/00; B32B15/08; B32B37/00; B32B37/10; B44C1/14; B44C1/16; H05K3/02; H05K3/38; B29K105/06; B29K105/22; B29L31/34; (IPC1-7): B32B31/20
Domestic Patent References:
| JPS57117869A | 1982-07-22 |
Attorney, Agent or Firm:
Akihide Sugimura