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Title:
ＣＯＦ型半導体パッケージ及び液晶表示装置
Document Type and Number:
Japanese Patent JPWO2016121579
Kind Code:
A1
Abstract:
本発明の一態様に係るＣＯＦ型半導体パッケージは、フィルムと、前記フィルム上に付着されたチップと、前記チップ上に設けられ、粘着層と、金属層と、熱放射フィラーおよびバインダーを含有する熱放射層と、絶縁層とを順に具備する熱放射シートと、を備える。

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Inventors:
Kenichi Nakanishi
Tatsuhiro Ikeya
Yoshikazu Arai
Application Number:
JP2016571962A
Publication Date:
December 14, 2017
Filing Date:
January 19, 2016
Export Citation:
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Assignee:
SHOWA DENKO K.K.
International Classes:
H01L23/373; G02F1/1333; G09F9/00; H01L21/60
Domestic Patent References:
JP2008028396A2008-02-07
JP2007180574A2007-07-12
JP2014160718A2014-09-04
JPH02295733A1990-12-06
Foreign References:
KR101465580B12014-11-26
WO2014002779A12014-01-03
Attorney, Agent or Firm:
Masatake Shiga
Suzuki Mitsuyoshi
Norihiko Ara



 
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