ABRASIVE PAD - MITSUBISHI MATERIALS CORP

Title:

ABRASIVE PAD

Document Type and Number:

Japanese Patent JP2001219362

Kind Code:

A

Abstract:

To easily eliminate bubbles remained between a platen and an abrasive pad.

Through holes 13 are formed on an abrasive pad 11 for penetrating from an abrasive face 11a to a pressure sensitive adhesive double coated tape 12 adhered to a lower face 11b as a face to be adhered to a platen 3.

Inventors:

OGATA YASUYUKI
KOBAYASHI TATSUNOBU
SUDA NOBUO

Application Number:

JP2000028150A

Publication Date:

August 14, 2001

Filing Date:

February 04, 2000

Export Citation:

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Assignee:

MITSUBISHI MATERIALS CORP

International Classes:

B24B37/20; B24B37/22; B24B37/26; H01L21/304; (IPC1-7): B24B37/00; H01L21/304

Attorney, Agent or Firm:

Masatake Shiga (6 people outside)

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