ACTIVE-ENERGY-RAY-CURABLE RESIN COMPOSITION

Japanese Patent JP2003138234

A

To provide an active-energy-ray-curable resin composition, especially an active-energy-ray-curable hardenable pressure-sensitive adhesive composition, in which the compatibility of an acrylic resin with a polymerizable oligomer is good and which exhibits excellent stickiness in bonding, can temporarily adhere to an adherend, is excellent in adhesive properties after the irradiation with an active energy ray, and strongly adheres to an adherend.

This active-energy-ray-curable resin composition comprises (A) an acrylic resin, (B) a urethane (meth)acrylate oligomer (B) obtained by reacting (B1) a polyol having a mol.wt. of 500 or higher, (B2) a polyisocyanate, and (B3) a hydroxyl-group-containing (meth)acrylate, (C) a photopolymerization initiator, and (D) a cross-linker, provided that at least one of such a polyol (B) having a mol.wt. of 500 or higher is an acrylic polyol (b).

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OKABE TOSHITAKA
MATSUNAMI HITOSHI
SUZUKI HATSUHIKO

JP2001337428A

May 14, 2003

November 02, 2001

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NIPPON SYNTHETIC CHEM IND

C08F2/44; C08F299/06; C08K5/34; C08L33/00; C08L35/00; C08L43/04; C08L63/00; C08L75/16; C09J133/00; C09J175/14; C08K5/29; (IPC1-7): C09J133/00; C08F2/44; C08F299/06; C08K5/29; C08K5/34; C08L33/00; C08L35/00; C08L43/04; C08L63/00; C08L75/16; C09J175/14

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