Title:
ADDITIVE PROCESS PRINTED WIRING BOARD ADHESIVE AGENT AND MANUFACTURE OF WIRING BOARD BY USE THEREOF
Document Type and Number:
Japanese Patent JP3536937
Kind Code:
B2
Abstract:
PURPOSE: To provide a method of manufacturing an additive wiring board adhesive agent high in adhesive power to plated copper and an adhesive sheet and a laminated board by the use of it.
CONSTITUTION: Adhesive agent is composed of 100 parts by weight of composition mainly formed of epoxy resin, acrylonitrile-butadien rubber, alkylphenol resin, and inorganic filler and 0.05 to 1.0 part by weight of internal releasing agent formed of long chain-phosphate tri- or di- or monoester having an alkyl group whose number of carbon atoms ranges from 6 to 18, and it is applied to a releasing support and dried up. Obtained adhesive agent sheets are provided sandwiching a prepreg impregnated with thermosetting resin between them, and the laminate is thermocompressed into one piece for the formation of an insulating board provided with adhesive agent, or base material formed of inorganic material or organic material or composite composed of inorganic and organic material is impregnated with thermosetting resin for the formation of prepreg, and a required number of prepregs are laminated and thermocompressed into an insulating board, and adhesive agent is applied onto the insulating board through a dip method or a curtain coating method and dried up.
Inventors:
Takanezawa, Shin
Irino, Tetsuro
Tosaka, Yuji
Kagaya, Takashi
Irino, Tetsuro
Tosaka, Yuji
Kagaya, Takashi
Application Number:
JP23195994A
Publication Date:
June 14, 2004
Filing Date:
September 28, 1994
Export Citation:
Assignee:
HITACHI CHEM CO LTD
International Classes:
C08K5/521; C08L63/00; C09J109/02; C09J121/00; C09J163/00; H05K3/38; (IPC1-7): H05K3/38; C08K5/521; C08L63/00; C09J109/02; C09J163/00