ADHESIVE, ADHEREND MEMBER, SEMICONDUCTOR-MOUNTING PRINTING. WIRING BOARD PROVIDED WITH ADHREND MEMBER AND SEMICONDUCTOR DEVICE USING THE SAME

Title:

ADHESIVE, ADHEREND MEMBER, SEMICONDUCTOR-MOUNTING PRINTING. WIRING BOARD PROVIDED WITH ADHREND MEMBER AND SEMICONDUCTOR DEVICE USING THE SAME

Document Type and Number:

Japanese Patent JP2001220565

Kind Code:

A

Abstract:

To provide an adhesive capable of securing the pot life at 25°C of three months or longer without losing the low elasticity, heat resistance and moisture resistance that are necessary at the time of mounting a semiconductor chip on a printing wiring board has a larger difference in the thermal expansion coefficient from the tip and is called an interposer for a glass epoxy substrate or flexible substrate.

The adhesive contains 100 pts.wt. of (1) an epoxy resin and a curing agent; 75-300 pts.wt. of (2) an epoxy group-containing acrylic copolymer, which contains 0.5-6 wt.% of glycidyl(meth)acrylate and has a Tg (a glass transition temperature) of -10°C or higher and a weight-average molecular weight of 800,000 or more; and 0.1-20 pts.wt. of (3) a latent curing accelerator.

Inventors:

TANAKA HIROKO
INADA TEIICHI
SHIMADA YASUSHI
KURITANI HIROYUKI
KAMISHIRO YASUSHI
YAMAMOTO KAZUNORI
SUMIYA KEIJI

Application Number:

JP2000180777A

Publication Date:

August 14, 2001

Filing Date:

June 16, 2000

Export Citation:

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Assignee:

HITACHI CHEMICAL CO LTD

International Classes:

C09J7/02; C09J11/06; C09J133/14; C09J163/00; H01L21/56; H01L21/60; (IPC1-7): C09J163/00; C09J7/02; C09J133/14; H01L21/56; H01L21/60

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