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Title:
PROCESS FOR PREPARING PRESSURE-SENSITIVE ADHESIVE COMPOSITION
Document Type and Number:
Japanese Patent JP2001220564
Kind Code:
A
Abstract:

To provide a process for preparing a solvent-free type, pressure- sensitive adhesive composition which process is a polymerization by an ultraviolet ray irradiation, at a fast rate of the polymerization, with little vaporization of a monomer when polymerizing and with little limitation on the monomer constitution and gives a polymer having a high molecular weight.

The process for preparing a pressure-sensitive adhesive composition is characterized by using, as the chief ingredient of the pressure-sensitive adhesive composition, an acrylic polymer that is formed by carrying out a polymerization while irradiating an ultraviolet ray having a substantially single wave length onto a composition consisting of a monomer of the main component of an alkyl (meth)acrylate and a photo-free radical generator and that has a glass transition temperature of 250 K or lower.


Inventors:
MOROISHI YUTAKA
SUGIMOTO MASAKAZU
INOUE YASUSHI
YAMAMOTO MICHIHARU
Application Number:
JP2000035641A
Publication Date:
August 14, 2001
Filing Date:
February 08, 2000
Export Citation:
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Assignee:
NITTO DENKO CORP
International Classes:
C09J133/06; (IPC1-7): C09J133/06
Attorney, Agent or Firm:
Ogi