Title:
ADJUSTMENT METHOD OF GRINDING DEVICE
Document Type and Number:
Japanese Patent JP2022071274
Kind Code:
A
Abstract:
To provide an adjustment method of a grinding device capable of reducing deviation of thickness of a workpiece which has been through creep feed grinding.SOLUTION: An adjustment method of a grinding device which is assembled with a chuck table, a grinding whetstone capable of rotationally moving over an annular track, and a thickness measurement unit for measuring a thickness of a workpiece, and is capable of executing creep feed grinding, includes: a grinding step of moving the chuck table holding the workpiece and the grinding whetstone rotationally moving, relatively along a Y axis direction and grinding a surface of the workpiece to be ground with the grinding whetstone; a thickness measuring step of measuring a thickness of the workpiece having been ground at a first end part and a second end part aligned in the Y axis direction and a third end part and a fourth end part aligned in an X axis direction orthogonal to the Y axis direction; and a tilt adjustment step of executing relative tilt adjustment of the annular track of the grinding whetstone and the holding surface of the chuck table based on the difference of thickness between the first end part and the second end part and the difference of thickness between the third end part and the fourth end part.SELECTED DRAWING: Figure 5
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Inventors:
YAMAMOTO DAISUKE
Application Number:
JP2020180142A
Publication Date:
May 16, 2022
Filing Date:
October 28, 2020
Export Citation:
Assignee:
DISCO ABRASIVE SYSTEMS LTD
International Classes:
B24B49/02; B24B7/04; H01L21/304
Attorney, Agent or Firm:
Matsumoto
Tomohiro Okamoto
Takahiro Kasahara
Hideaki Okamoto
Takayuki Okano
Toshikazu Imato
Tomohiro Okamoto
Takahiro Kasahara
Hideaki Okamoto
Takayuki Okano
Toshikazu Imato