Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
ALIGNMENT APPARATUS
Document Type and Number:
Japanese Patent JP3387068
Kind Code:
B2
Abstract:

PURPOSE: To achieve that recesses parts in an alignment mark are made substantially symmetric with respect to a beam of light for position detection use and to reduce the detection error of the title apparatus in an alignment operation by a method wherein the width in an alignment direction of the recessed parts in the alignment mark is set to be narrower than the length of three times the wavelength of the beam of light for position detection use.
CONSTITUTION: The width (d) of recesses parts 2b in a wafer mark is set to be narrower than the length 3λ (or 3λ/n) of three times the wavelength λ of laser beams LB1, LB2 as beams of alignment detection light. At the inside of the recesses parts 2b, the laser beams LB1, LB12 are attenuated exponentially and hardly reach the bottom part. Consequently, even when a difference in level Δh1 is caused at the bottom of each recessed part 2h and the wafer mark becomes asymmetric in the X-direction, the wafer mark is equivalent to a symmetric mark with reference to the laser beams LB1, LB2. Consequently, a measured result by means of the laser beams LB1, LB2 becomes accurately the position of the mark and the detection error of the title apparatus is not caused.


Inventors:
Kazuya Ohta
Application Number:
JP28437092A
Publication Date:
March 17, 2003
Filing Date:
October 22, 1992
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
NIKON CORPORATION
International Classes:
G03F9/00; H01L21/027; H01L21/30; (IPC1-7): H01L21/027; G03F9/00
Domestic Patent References:
JP254103A
JP242712A
JP1243445A
JP3268316A
Attorney, Agent or Firm:
Satoshi Ohmori