PURPOSE: To prevent the occurrence of breakage between circuit terminals which should be connected to each other and the occurrence of a short circuit between circuit terminals which should not be connected to each other by prohibiting the movement and abnormal cohesion of conductive particles in an anisotropic conductive adhesive tape, which may be turned into a fluid state during the bonding process of electronic parts.

CONSTITUTION: A first tape-like adhesive layer 21 is formed of an adhesive 23 having low fluidity at the melting time and conductive particles 22 included in this adhesive. The conductive particles 22 are substantially 5-10μm in diameter, while the first adhesive layer 21 has substantially the same thickness as the size of the conductive particles 22. On both faces of the first adhesive layer 21 are formed second adhesive layers 24 which contain no conductive particles, and which are formed only of an adhesive having insulation properties. A material having easily fluidal properties under heating and pressure at the time of a bonding process is selected as the material of an adhesive for the second adhesive layers 24, and the adhesive layers 24 are so selected as to have a thickness enough to bond electronic parts.