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Title:
ANISOTROPIC CONDUCTIVE FILM, METHOD FOR MANUFACTURING THE SAME AND CONNECTION STRUCTURE
Document Type and Number:
Japanese Patent JP2010251337
Kind Code:
A
Abstract:

To provide: an anisotropic conductive film that localizes conductive particles just on an electrode even using conventional mounting and connecting procedures; a method for manufacturing the same; and a connection structure.

The anisotropic conductive films 1, 11, and 21 include adhesive layers whose adhesive component contains conductive particles dispersed therein. The conductive particles are localized in accordance with an electrode pattern of an object to be connected in the adhesive component. In producing the anisotropic conductive film 1, 11, and 21, the adhesive component containing the conductive particles is applied to a substrate 31 and the conductive particles are localized in a position in accordance with the electrode pattern with a magnetic force while the adhesive component is uncured. For example, an electromagnetic roll 35, whose peripheral surface is provided with linear projected strips 35b and linear grooves 35a at a predetermined interval, is disposed near the anisotropic film to localize the conductive particles linearly with a magnetic force from the projected strips 35b.


Inventors:
ITO MASAHIKO
Application Number:
JP2010176671A
Publication Date:
November 04, 2010
Filing Date:
August 05, 2010
Export Citation:
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Assignee:
SONY CHEM & INF DEVICE CORP
International Classes:
H01R11/01; C09J7/02; C09J9/02; H01R43/00
Attorney, Agent or Firm:
Akira Koike
Seiji Iga
Toshiya Fujii
Nobuhiro Noguchi
Yusei Atsuya