To improve the yields of an antenna circuit and IC mounting by wiring the line width of an antenna wire passing through an IC mounting part with wire with fixed width being equal to and less than a specified value.
After a vacuum evaporated film of a conductive metal is formed on a base film having prescribed ruggedness on the surface, and an antenna circuit is formed by printing adhesive on a base material surface forming the antenna circuit and continuously copying a vacuum evaporated film into the part. The line width of the periphery 3 of an IC chip attached to the antenna circuit and the antenna circuit passing between IC connection bumps 2 is thinner than that of an antenna main body 1 and also formed with fixed width ≤0.3 mm. In a normal case, the line width of the body 1 is made thin gradually to be a fixed thin width between the bumps 2. The formation of a pattern whose width gets small gradually is difficult to control the peel state of the vacuum evaporated film in a copying mode, and copying can be performed with higher accuracy when the width is a fixed thin line.
SHINOMIYA TERUHIRO
NISHIGATA JUNICHI
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