To provide a semiconductor device such as a non-contact IC card, a non-contact IC tag, a non-contact IC button, or a non-contact IC coin whose costs can be reduced, and whose durability can be made excellent.

The whole outer periphery of a bear IC chip 1 with a built-in antenna coil in which an antenna coil 1a is incorporated is sealed by a first package member 2 made of thermo-setting resin such as epoxy resin. Also, the periphery of the first package member 2 is sealed by a second package member 3 made of thermoplastic resin such as ABS resin, polypropylene resin, vinyl chloride resin, or polyethylene terephthalate resin, and this semiconductor device can be finished in a prescribed shape such as a card shape, a tag shape, a button shape, or a coin shape. The IC chip 1 is protected by the first package member 2, and flexibility is applied to the semiconductor device by the second package member 3.