To provide a module for a non-contact type IC card and a non-contact type IC card for increasing yield and reducing costs.

In a non-contact IC card, the size and weight of an IC chip 16 is made extremely small and light so that the hardness of two terminal wires 15 arranged across a spatial part 13 formed in a substrate 12 and fixed in the neighborhood can be made relatively high, and that this IC chip 16 can be easily held even at the time of handling in a card manufacturing process. The size of the spatial part 13 is made small so that a protecting function against any outer force can be secured at the time of handling. In assembling a card, even when a plastic plate 17 is mounted on the both face of the module by thermal fusion or the like, any excessive force can be prevented from being imposed on the IC chip 16, any yield can be increased. In combining the IC chip 16 with a coil 14 made of enamel coated aluminum wires, direct bonding is attained. Thus, it is not necessary to interpose any gold on a boundary face between the IC chip 16 and the terminal wires 15 so that it is possible to reduce costs.