Title:
APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2003229446
Kind Code:
A
Abstract:
To manufacture a semiconductor device with high yields even with minute electronic components.
A tip of a metal wire 3 is melted to form a metal ball 3a. The metal ball 3a is held between an electrode 1a on a first electronic component 1 and a bonding tool 7 to bond the metal ball 3a to the electrode 1a. Thereafter, with the metal ball 3a still being held between the electrode 1a and the bonding tool 7, the metal wire 3 is cut from the metal ball 3a to form a bump 4 on the electrode 1a. The first electronic component 1 is connected to a second electronic component 2 via the bump 4.
Inventors:
ISHIZAKI MITSUNORI
KITAMURA YOICHI
KITAMURA YOICHI
Application Number:
JP2002025302A
Publication Date:
August 15, 2003
Filing Date:
February 01, 2002
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
B23D23/00; H01L21/60; (IPC1-7): H01L21/60; B23D23/00
Attorney, Agent or Firm:
Keigo Murakami (3 outside)