Title:
MOLDING STORAGE APPARATUS AND RESIN SEALING APPARATUS
Document Type and Number:
Japanese Patent JP2003229444
Kind Code:
A
Abstract:
To provide a molding storage apparatus capable of storing molding along with correcting warpage.
A pickup device 26 stores the molding (substrate 2) in a storage magazine 27, and then puts a presser plate 36 from a presser plate storage magazine 28 on the molding (substrate 2) and stores the presser plate on the molding. The pickup apparatus 26 repeats this operation for each molding.
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Inventors:
KOBAYASHI KAZUHIKO
MIYAGAWA TSUTOMU
TAGAMI SHUSAKU
GOTO NAOYA
MIYAGAWA TSUTOMU
TAGAMI SHUSAKU
GOTO NAOYA
Application Number:
JP2002329901A
Publication Date:
August 15, 2003
Filing Date:
November 13, 2002
Export Citation:
Assignee:
APIC YAMADA CORP
International Classes:
H01L21/56; (IPC1-7): H01L21/56
Attorney, Agent or Firm:
Takao Watanuki (1 outside)
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