To provide an apparatus and method for mounting components, whereby for mounting the components on a board, the warpage of the board surface is accurately measured by a simple method to correct the mounting height and an adequate mounting can be made without loss or mounting position deviation of the components.

A deviation z of an arbitrary point (x, y) on a printed board 14 surface from a component mounting reference plane 16 is measured, using a laser displacement meter 18. An arithmetic processor 20, based on the measured data, obtains approximately the warpage of the printed board 14 surface according to, e.g. the equation of a quadratic curved surface x=ay2+by+c to calculate a correction Δh of the mounting height at a prescribed mounting position on the printed board 14 surface, a nozzle 12 which vacuum chucks an electronic component 10 is lowered by a corrected mounting height h±Δh, where h is conventional mounting height, and the component 10 is mounted on the printed board 14.