Title:
APPARATUS FOR MOUNTING SURFACE MOUNTING TYPE COMPONENT
Document Type and Number:
Japanese Patent JP2000299596
Kind Code:
A
Abstract:
To minimize the time taken for vacuum chucking of an electronic component.
A predicting means 130 computes in advance nozzles which are incapable of component recognition during component vacuum chucking or component mounting by other nozzles, using mounting order data. A nozzle position control means 140 allocates the component recognition time, when the nozzles pass through by component recognition positions until the component mounting on a circuit board ends after the nozzles predicted by the predicting means 130 vacuum chuck components.
Inventors:
TAKANO TAKAO
Application Number:
JP10973599A
Publication Date:
October 24, 2000
Filing Date:
April 16, 1999
Export Citation:
Assignee:
SONY CORP
International Classes:
B23Q7/02; B23Q7/04; H05K13/04; H05K13/08; (IPC1-7): H05K13/04; B23Q7/02; B23Q7/04; H05K13/08