To provide an apparatus and method for wire bonding, having a surface treating and bonding zones and good contact balance.

The apparatus has a controller 25 which compares the bonding end time of substrates being bonding in a bonding zone 6 after surface treatment in a surface treating zone 5 with the surface treating end time of substrates 2 to be treated in the surface treating zone 5, instructs a conveyer to carry the surface treated substrates in the surface treating zone to a surface treated magazine 20 if the bonding end time is later than the surface treatment end time, and instructs the conveyer to carry the surface treated substrate in the surface treating zone to the bonding zone to wire the carried structures therein, if reverse.