Title:
BONDING WIRE AND MANUFACTURE THEREOF
Document Type and Number:
Japanese Patent JPH1050754
Kind Code:
A
Abstract:
To provide a bonding wire which little cause the loop trouble even in the form of a long looped wire and manufacture thereof.
The bonding wired has at least a film of a mineral oil, animal/ plant oil, synthetic oil or surfactant formed on the surface of a very thin metal wire by the dip electrodeposition or spray coating. This film thickness has a gradient measured by the atmospheric ultraviolet photoelectron method i.e., normalized photoelectron absorption Y divided by exciting energy eV is 15-40Y/eV, pref. 20-30Y/eV in this method.
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Inventors:
KUBO TOSHIYUKI
Application Number:
JP20470396A
Publication Date:
February 20, 1998
Filing Date:
August 02, 1996
Export Citation:
Assignee:
SUMITOMO METAL MINING CO
International Classes:
H01L21/60; (IPC1-7): H01L21/60