Title:
APPARATUS FOR POSITIONING ELECTRONIC COMPONENT
Document Type and Number:
Japanese Patent JP2003101298
Kind Code:
A
Abstract:
To protect an electronic component against cracking due to pressure at the time of mounting by sucking the electronic component accurately.
The positioning pin 21 of a positioning mechanism and the movable pin 31 of a positioning movable mechanism are moved by means of first and second spring members 29 and 39. A suction head 51 sucks an electronic component 11 from the frame part 51a thereof without projecting it. When the electronic component 11 is sucked by the suction head 51, it is sucked while pushing down the positioning pin 21 and the movable pin 31 slightly by means of the frame part 51a. The movable pin 31 is released when the outer circumferential part of the electronic component 11 slightly enters the frame part 51a.
Inventors:
MURATA KAZUHITO
Application Number:
JP2001296622A
Publication Date:
April 04, 2003
Filing Date:
September 27, 2001
Export Citation:
Assignee:
NEC CORP
International Classes:
B25J15/06; B23P19/00; H05K13/04; (IPC1-7): H05K13/04; B23P19/00; B25J15/06
Attorney, Agent or Firm:
Yosuke Goto (1 person outside)
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