APPARATUS FOR RELEASING SEMICONDUCTOR WAFER AND METHOD OF MANUFACTURING THE SAME

Title:

APPARATUS FOR RELEASING SEMICONDUCTOR WAFER AND METHOD OF MANUFACTURING THE SAME

Document Type and Number:

Japanese Patent JP2002064073

Kind Code:

A

Abstract:

To enable unmanned processing of a series of operations from releasing a wafer after being polished from a wafer bonded plate to loading the wafer into a wafer accommodating carrier.

The apparatus includes a plate transfer roller 2, a plate transfer device 3 having four divisions of a plate acceptance stage 3a, a wafer positioning stage 3b, a wafer releasing stage 3c and a plate discharging stage 3d, a laser displacement meter 7 for detecting a wafer bonded position, a wafer releasing robot 4, a wafer transfer mechanism 5 for transferring wafer 10 released from a wafer bonded plate 1 to a carrier loader 6 for wafer accommodation, and a plate discharging roller 11 for transferring the plate 1 having the wafer 10 released therefrom outside of the apparatus.

Inventors:

YOKOYAMA KAZUYUKI
AZUMA JIYUNICHIROU
MIZOWAKI KOJI

Application Number:

JP2001176481A

Publication Date:

February 28, 2002

Filing Date:

November 18, 1994

Export Citation:

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Assignee:

KOMATSU DENSHI KINZOKU KK

International Classes:

B24B37/04; H01L21/304; H01L21/677; H01L21/68; H01L21/683; (IPC1-7): H01L21/304; B24B37/04; H01L21/68

Attorney, Agent or Firm:

Hideharu Tanaka

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