To accurately bond a wafer onto a bonding plate at a fixed position.

Wafer guides (8),... are positioned in the vicinity of a bonding surface (5) of a bonding plate 1. A wafer (2) is mounted on a part of the plate surrounded by the wafer guides (8). The wafer (2) is prevented by the wafer guides (8) from being moved horizontally. Under this condition, the wafer (2) is pushed by an air stamp (3) with one rush and bonded onto the bonding surface (5).