To avoid generation of a water dead zone due to obstruction of a liq. treating member by providing a water dead zone blocking member, having a shape fitted to the water dead zone which corresponds to the opposite outside of a pipe to its treating liq. draining direction from its drain hole, for draining a treating liq. toward the bottom face of a treating tank.
A treating liq. which is drained from a treating liq. feed pipe 2 is reflected at the bottom face of a treating tank and guided to a work housing space through treating liq. pass holes of a baffle 3, the treating liq. feed pipe 2 acts as an obstruction during guiding of the treating liq. reflected at the bottom face of the treating tank to the work housing space, via the treating liq. pass holes of a baffle 3 in processing semiconductor wafers, but a thick wall part 2c formed beforehand at a position foreseen to generate a water dead zone blocks the water dead zone from generating, thus allowing the treating liq. to be replaced smoothly in the treating tank, when a plurality of kinds of treating liqs. are fed successively to a treating tank for treating the semiconductor wafers.
KI KANNAN
ONO MASAO
DAIKIN IND LTD
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