Title:
AQUEOUS DISPERSION TYPE ACRYLIC ADHESIVE SHEET FOR REPEELING AND ADHESIVE COMPOSITION USED FOR THE SHEET
Document Type and Number:
Japanese Patent JP3908929
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide an aqueous dispersion type acrylic adhesive sheet for repeeling which comprises an aqueous dispersion type adhesive enabling to coat it in an aqueous type, can suitably be used for particularly the adhesive sheet for a semiconducting wafer processing, and causes a little stain on a surface of an adherend.
SOLUTION: In the aqueous dispersion type acrylic adhesive sheet comprising forming on a substrate an adhesive layer comprising an adhesive composition containing an acrylic emulsion type polymer as a principal component, the sheet being applied on the adherend, and then repeeled, the sheet for repeeling having low staining properties is that when the sheet is applied to on an aluminum metallized wafer, kept for 24 hr at 40°C, and then repeeled, an increased amount of carbon atoms on the wafer is ≤5 atomic %, and further when the sheet is applied onto a 4 inch mirror wafer, kept for 1 hr at 23°C, and then repeeled, the particle number of ≥0.28 μm on the wafer is ≤25 pieces of particle/4 inch wafer.
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Inventors:
Katsuhiko Kamiya
Charlie Mathieu
Kazuhiko Yamamoto
Keisuke Watanabe
Ken Matsumura
Charlie Mathieu
Kazuhiko Yamamoto
Keisuke Watanabe
Ken Matsumura
Application Number:
JP2001307474A
Publication Date:
April 25, 2007
Filing Date:
October 03, 2001
Export Citation:
Assignee:
NITTO DENKO CORPORATION
International Classes:
C09J7/02; C08F2/24; C08F220/00; C09J133/00; (IPC1-7): C09J7/02; C08F2/24; C08F220/00; C09J133/00
Domestic Patent References:
| JP6029266A | ||||
| JP4186832A | ||||
| JP6322338A |