Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
AQUEOUS EPOXY RESIN DISPERSION
Document Type and Number:
Japanese Patent JPH06322069
Kind Code:
A
Abstract:

PURPOSE: To obtain an aqueous epoxy resin dispersion improved in chemical, sterilization, low-temperature sterilization and water resistances by including a specified epoxy resin, a dispersant and a carboxyl-containing or -releasing curing agent.

CONSTITUTION: 50-95 wt.% epoxy compound having an epoxy equivalent of 100-2,000 and having at least two epoxy groups in the molecule, 5-50 wt.% aromatic polyol and 0.5-25 wt.% modifying compound having at least two epoxide-reactive groups are subjected to a condensation reaction to obtain an epoxy resin (A). Component A is mixed with a dispersant (B) having an epoxy equivalent of 5,000-400,000 g/mol and prepared by condensing an aliphatic polyol having a weight-average molecular weight of 200-2,000 with an epoxy compound having an epoxy equivalent of 100-2,000 and having at least two epoxy groups in an OH/epoxy equivalent ratio of 1:(0.8-3.5) and a carboxyl- containing or -releasing curing agent (C) having a carboxyl functionality of at least 3 in such amounts that the epoxy/carboxyl equivalent ratio is 1:0.5 or higher.


Inventors:
ARUMIN PUFUAIRU
IERUGU PEETAA GAISURAA
PAURU OOBAARETSUSERU
DEIITAA DORAISHIYUHOTSUFU
Application Number:
JP5203094A
Publication Date:
November 22, 1994
Filing Date:
March 23, 1994
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
HOECHST AG
International Classes:
C08G59/20; C08G59/04; C08G59/42; C08L63/00; C09D5/00; C09D5/02; C09D163/00; (IPC1-7): C08G59/20; C08G59/42; C08L63/00; C09D5/00; C09D5/02; C09D163/00
Attorney, Agent or Firm:
Mitsufumi Esaki (2 others)