Title:
MANUFACTURING METHOD OF ATOMIC FILM AND ATOMIC FILM
Document Type and Number:
Japanese Patent JP2022137690
Kind Code:
A
Abstract:
To provide a manufacturing method, etc. for an atomic film capable of peeling and separating a large area of the atomic film from a multilayer atomic film or bulk layered crystal.SOLUTION: A manufacturing method for an atomic film includes the steps of physically peeling an atomic film from a multilayer atomic film or a layered bulk crystal using a peeling substrate and transferring the peeled atomic film onto a transfer substrate. Embodiments where the peeled substrate is dimethylpolysiloxane and the peeled substrate is dimethylpolysiloxane with a hydrophilically processed surface are preferable.SELECTED DRAWING: Figure 1E
More Like This:
Inventors:
HAYASHI KENJIRO
Application Number:
JP2021037297A
Publication Date:
September 22, 2022
Filing Date:
March 09, 2021
Export Citation:
Assignee:
FUJITSU LTD
International Classes:
H01L21/02; C01B32/19
Attorney, Agent or Firm:
Tadashige Ito
Tadahiko Ito
Koichi Hirota
Tadahiko Ito
Koichi Hirota