Title:
BASE SUBSTRATE FOR PRINTED WIRING BOARD AND MULTILAYER PRINTED WIRING BOARD THAT USE POLYIMIDE BENZOXAZOLE FILM AS INSULATING LAYER
Document Type and Number:
Japanese Patent JP2008135759
Kind Code:
A
Abstract:
To provide a polyimide benzoxazole film that is suitable for a base material of an electronic component capable of enduring extremely high temperatures, and has high rigidity and extremely high heat resistance.
A polyimide benzoxazole film is formed through polycondensation of aromatic diamines having a benzoxazole structure and aromatic tetracarboxylic anhydrides. When the polyimide benzoxazole film is heated at 500C for 10 seconds after being preliminarily dried at 170C for 7 minutes under an inert gas atmosphere, the amount of water vaporized during the heating process is not more than 10,000 ppm relative to the same polyimide benzoxazole film before being subjected to the preliminary drying process.
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Inventors:
KAWAHARA KEIZO
MAEDA SATOSHI
YASUI JUN
TSUTSUMI MASAYUKI
YOSHIDA TAKESHI
MORINO MORIO
KURAHARA SHUNJI
MAEDA SATOSHI
YASUI JUN
TSUTSUMI MASAYUKI
YOSHIDA TAKESHI
MORINO MORIO
KURAHARA SHUNJI
Application Number:
JP2007316710A
Publication Date:
June 12, 2008
Filing Date:
December 07, 2007
Export Citation:
Assignee:
TOYO BOSEKI
International Classes:
H05K1/03; B32B27/34; C08G73/10; C08G73/22; H05K3/46