Title:
BOARD DEVICE
Document Type and Number:
Japanese Patent JP2015170685
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a board device including a resin board and a ceramic board bonded using plural bumps capable of reducing a thermal stress generated due to a linear expansion coefficient difference between a resin board and a ceramic board.SOLUTION: The board device includes: a first circuit board formed with plural concave parts which are filled with low-temperature solder and connected to conductor terminals positioned in the bottom of the concave parts; and a second circuit board which has a linear expansion coefficient different from that of the first circuit board, the conductor terminal of which is connected to the first circuit board via plural bumps joined to the low-temperature solder of the concave part. With this, the thermal stress generated between the resin board 1 and the ceramic board 2 is reduced.
Inventors:
NUNOME KOTONO
Application Number:
JP2014043663A
Publication Date:
September 28, 2015
Filing Date:
March 06, 2014
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
H05K1/14; H01L21/60; H01L23/12; H05K3/34
Attorney, Agent or Firm:
Tadahiko Inaba
Kanako Murakami
Shigeaki Matsui
Kuratani Yasutaka
Kanako Murakami
Shigeaki Matsui
Kuratani Yasutaka