Title:
BOARD-MOUNTING TYPE HEAT-EXCHANGING STRUCTURE
Document Type and Number:
Japanese Patent JP3414996
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To enhance cooling efficiency, while suppressing increase in the height dimension of a part-mounting board by employing a heat pipe and a board ground layer as a heat transfer body for thermally coupling a heat-exchanging part and a heat receiving/spreading part, thereby releasing restriction on the mounting position of a high heat generating element.
SOLUTION: A heat-exchanging part 1 and a heat receiving/spreading part 2 are arranged separately on a board 5 mounting a plurality of semiconductor elements, constituting an electronic circuit, while being coupled thermally through a heat pipe 3 and a board ground layer 4. A heat spreading part 6 is coupled thermally with the heat-exchanging part 1 through the board ground layer 4. The heat exchanging part 1 is provided with a large number of heat dissipation pins, having high thermal conductivity connected with an inner layer ground through a through-hole. The heat exchanging part 1 is composed of a member satisfactory in solderability and thermal conductivity and is preferably bonded to the inner layer ground exposed to the surface of the mounting board 5.
Inventors:
Takashi Kitahara
Application Number:
JP23590697A
Publication Date:
June 09, 2003
Filing Date:
September 01, 1997
Export Citation:
Assignee:
Pfu corporation
International Classes:
F28D15/02; H05K7/20; (IPC1-7): H05K7/20; F28D15/02
Domestic Patent References:
| JP3196657A | ||||
| JP7106721A | ||||
| JP669613A | ||||
| JP1152691A | ||||
| JP8274480A |