Title:
BONDING DEVICE
Document Type and Number:
Japanese Patent JPH0786336
Kind Code:
A
Abstract:
PURPOSE: To simplify and collectively bond a plurality of parts of different shapes in a short period.
CONSTITUTION: A plurality of heads 32 movable freely in an up-and-down manner are provided on the block 31, where a heater 33 is buried, located above the substrate 23 on which IC chips 252, 25b,... and chip parts 26a, 26b,... are plaud through the intermediary of a bump electrode 24 and solder 27. A bonding operation is conducted by bringing the prescribed head 32 into contact with the part.
Inventors:
YUDA TAKASHI
SAKATA TOSHIO
SAKATA TOSHIO
Application Number:
JP22622393A
Publication Date:
March 31, 1995
Filing Date:
September 10, 1993
Export Citation:
Assignee:
FUJITSU LTD
International Classes:
B23P21/00; H01L21/60; H05K3/32; (IPC1-7): H01L21/60; B23P21/00; H05K3/32
Attorney, Agent or Firm:
Tadahiko Ito
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