Title:
BONDING WIRE
Document Type and Number:
Japanese Patent JPH05166870
Kind Code:
A
Abstract:
PURPOSE: To reduce the inductance of a bonding wire which connects a semiconductor integrated circuit chip to the outside.
CONSTITUTION: The self-inductance of a bonding wire 10 is reduced by making the shape of the wire hollow or very thin. Thereby, a counterelectromotive force by an electric current flowing in the bonding wire 10 is reduced, and a noise which is generated in a semiconductor integrated circuit is suppressed.
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Inventors:
HORIUCHI TAKUMI
Application Number:
JP35344091A
Publication Date:
July 02, 1993
Filing Date:
December 17, 1991
Export Citation:
Assignee:
NIPPON STEEL CORP
International Classes:
H01L21/60; H01L23/49; (IPC1-7): H01L21/60
Attorney, Agent or Firm:
Kokubun Takaetsu