Title:
BORING METHOD
Document Type and Number:
Japanese Patent JP2017140680
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a boring method capable of executing boring with desired processing accuracy while suppressing chips during the boring from getting stuck to remain in a through-hole when boring is carried out near the through-hole formed in a workpiece by a plurality of processes.SOLUTION: This boring method includes, in a process selected from a plurality of processes: determining whether the sizes of generated chips are larger than the maximum size of a chip passable through a water jacket 30 (step S22); executing the selected process without spraying coolants when it is determined that the sizes of the generated chips are larger than the maximum size (first processing step S23); and executing the selected process while spraying coolants when it is determined that the sizes of the generated chips are smaller than the maximum size (second processing step S24).SELECTED DRAWING: Figure 4
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Inventors:
MATSUMOTO KAZUYA
Application Number:
JP2016024730A
Publication Date:
August 17, 2017
Filing Date:
February 12, 2016
Export Citation:
Assignee:
TOYOTA MOTOR CORP
International Classes:
B23B35/00; B23B47/00; B23Q11/00; B23Q11/10
Attorney, Agent or Firm:
Yusuke Hiraki
Sekiya Mitsuo
Ishikawa Takiharu
Yasuhiko Mima
Sekiya Mitsuo
Ishikawa Takiharu
Yasuhiko Mima
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