Title:
BREAK DEVICE AND BREAK METHOD FOR BRITTLE MATERIAL SUBSTRATE
Document Type and Number:
Japanese Patent JP2020151929
Kind Code:
A
Abstract:
To provide a break device which obtains a high-quality product by restricting damages to a substrate surface when segmenting the substrate.SOLUTION: A break device includes: a pair of right and left receiving blades 1 and 2 provided with corner parts 1a and 1b on an end side of a substrate placing surface; and a pushing blade 3. In the break device, the receiving blades are disposed such that the corner parts are mutually in parallel at an interval from each other, the pushing blade is arranged so that it can be pushed-in between the receiving blades, and a brittle material substrate W to be segmented is placed such that a scribe line S formed on its surface is placed in parallel to the corner parts. Further, the break device is constituted to chamfer the corner parts of the receiving blades with a minute radius of 0.05-0.2 mm.SELECTED DRAWING: Figure 1
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Inventors:
MITANI TAKURO
TAMURA KENTA
TAMURA KENTA
Application Number:
JP2019052048A
Publication Date:
September 24, 2020
Filing Date:
March 20, 2019
Export Citation:
Assignee:
MITSUBOSHI DIAMOND IND CO LTD
International Classes:
B28D5/00; B28D7/04; H01L21/301
Domestic Patent References:
| JP2007302543A | 2007-11-22 | |||
| JP2002187098A | 2002-07-02 | |||
| JP2009095901A | 2009-05-07 | |||
| JP2016040079A | 2016-03-24 | |||
| JP2006124194A | 2006-05-18 |
Foreign References:
| EP2602233A1 | 2013-06-12 |
Attorney, Agent or Firm:
Yoshio Kashima