Title:
CATALYZING IN ELECTROLESS PLATING
Document Type and Number:
Japanese Patent JP3022226
Kind Code:
B2
Abstract:
PURPOSE: To collect a catalytic metal participating in the adhesive strength between a plating layer and a layer to be plated in electroless plating without depending on the sensitizing-activating method or catalyst-acceleration method.
CONSTITUTION: When an electroless plating layer is formed on the surface of a nonconductive material, a processing soln. contg. at least chitosan or a chitosan derivative is applied on the nonconductive material surface prior to catalyst impartation and electroless plating to form a hydrophilic coating film on the surface. A catalystic metal such as palladium is chemically adsorbed through the chitosan, collected and fixed in the hydrophilic coating film thus formed. Consequently, a sufficient amt. of active catalyst is deposited on the surface of a material to be plated in electroless plating, and a highly adhesive electroless plating layer is uniformly and efficiently formed thereon.
Inventors:
Yoshihiko Ohmura
Application Number:
JP33109794A
Publication Date:
March 15, 2000
Filing Date:
December 08, 1994
Export Citation:
Assignee:
Daishin Chemical Co., Ltd.
Omura Paint Co., Ltd.
Omura Paint Co., Ltd.
International Classes:
C23C18/20; C23C18/28; C23C18/22; C23C18/30; F02B75/02; H05K3/18; H05K3/38; (IPC1-7): C23C18/28
Domestic Patent References:
| JP3271375A |
Attorney, Agent or Firm:
Jiro Tanaka