Title:
CERAMIC CHIP ELECTRONIC COMPONENT AND ITS MANUFACTURING METHOD
Document Type and Number:
Japanese Patent JP2006295076
Kind Code:
A
Abstract:
To obtain an electronic component having external electrodes 5, 6, 7, 8 for elements such as capacitor elements 2, 3 formed on the side face of a ceramic chip body 4 provided with the elements, wherein cracking or chipping of the chip body 4 due to external impact or difference in thermal expansion is reduced under a state where it can be mounted on a printed board and soldered.
At the position of an external electrode on the side face of a chip body, a conductive elastic resin film 9 covering the external electrode is formed to extend up to a part of the mounting surface of the chip body, and a metal plating film 10 for soldering is formed on the surface of the conductive elastic resin film.
Inventors:
TOMINAGA YUKIO
Application Number:
JP2005117347A
Publication Date:
October 26, 2006
Filing Date:
April 14, 2005
Export Citation:
Assignee:
ROHM CO LTD
International Classes:
H01G4/12; H01G4/252; H01G4/30
Attorney, Agent or Firm:
Akio Ishii
Tadashi Higashino
Hiroyuki Nishi
Tadashi Higashino
Hiroyuki Nishi