Title:
CERAMIC CHIP ELECTRONIC COMPONENT AND ITS MANUFACTURING PROCESS
Document Type and Number:
Japanese Patent JP2006295077
Kind Code:
A
Abstract:
To obtain a ceramic chip electronic component having: external electrodes 5, 6, 7, 8 for elements such as capacitor elements 2, 3 formed on the side face of a ceramic chip body 4 provided with the elements; a conductive elastic resin film 9 formed on the surface of the external electrode and mixed with metal powder; and a metal plating film 10 for soldering formed on the surface of the conductive elastic resin film, wherein stripping of the metal plating film 10 is reduced.
The conductive elastic resin film 9 is subjected to surface processing such that metal powder in the conductive elastic resin film is exposed to the surface.
Inventors:
TOMINAGA YUKIO
Application Number:
JP2005117348A
Publication Date:
October 26, 2006
Filing Date:
April 14, 2005
Export Citation:
Assignee:
ROHM CO LTD
International Classes:
H01G4/12; H01G4/252; H01G4/30
Attorney, Agent or Firm:
Akio Ishii
Tadashi Higashino
Hiroyuki Nishi
Tadashi Higashino
Hiroyuki Nishi