Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
STRUCTURE FOR CONNECTING MAIN BOARD WITH FLEXIBLE PRINT, AND ITS CONNECTING METHOD
Document Type and Number:
Japanese Patent JP2006295078
Kind Code:
A
Abstract:

To provide a structure for connecting a main board with a flexible printed board which can improve strength for connecting the main board with the flexible printed board opposed to a stress of the main board from the outside direction, and can reduce a production cost.

First, a solder printing is carried out using a metal mask etc., a solder 10 is mounted on a land 4 of the main board 1, and a solder 11 is mounted on a land 5. Next, an FPC 2 is mounted on the main board 1 using a mounter so that the land 5 of the main board 1 and the through-hole 8 of the FPC 2 overlap each other, and a reinforcing material 9 is mounted on the FPC 2 to cover the through-hole 8. Next, the solder 10 and the solder 11 are melted using a reflow apparatus etc. and by hardening the solder 10 and the solder 11, the land 4 and a land 7 are connected through the solder 10, and the land 5 and the reinforcing material 9 are connected through the solder 11.


Inventors:
KAMIYAMA DAIZO
Application Number:
JP2005117395A
Publication Date:
October 26, 2006
Filing Date:
April 14, 2005
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
TOYOTA IND CORP
International Classes:
H05K1/14; H05K3/36
Attorney, Agent or Firm:
Yoshiyuki Osuga