PURPOSE: To provide a method of manufacturing a ceramic electronic component, which inhibits and prevents the generation of a crack, a break or the like in an element main body and can improve the yield of the electronic component, and the highly reliable ceramic electronic component of a structure that the crack, the break or the like is hardly generated in the element main body at the time of transportation of the electronic component or in a process of packaging the electronic component and the like.
CONSTITUTION: An element main body 1 is polished in such a way that in the case where the polishing of the main body 1 is executed on the sections in roughly the rectangular direction to the longitudinal direction of the main body 1 and the section on at least one side of the sections in roughly the rectangular direction to the width direction of the main body 1, the ratio of the total of the removal areas of the sections due to polishing of each square part 2 to the total of the areas prior to polishing of the sections is 0.4% or higher to 1.
YONEDA YASUNOBU
TAKAKURA SHINICHI
