Title:
セラミック電子部品およびその製造方法
Document Type and Number:
Japanese Patent JP7492306
Kind Code:
B2
Abstract:
A ceramic electronic component includes a multilayer chip having a substantially rectangular parallelepiped shape and including a first multilayer structure and a second multilayer structure disposed on each of top and bottom faces of the first multilayer structure, the first multilayer structure including first ceramic dielectric layers having a first width in a first direction in which side faces of the multilayer chip are opposite to each other, the second multilayer structure including second internal electrode layers having a second width less than the first width in the first direction, and a pair of external electrodes formed from the respective two edge faces to at least one of side faces of the multilayer chip, wherein main components of the first and second internal electrode layers differ from a main component of the external electrodes.
Inventors:
Yuuto Yamato
Hisashi Asai
Takayuki Hattori
Hisashi Asai
Takayuki Hattori
Application Number:
JP2020089360A
Publication Date:
May 29, 2024
Filing Date:
May 22, 2020
Export Citation:
Assignee:
TAIYO YUDEN CO.,LTD.
International Classes:
H01G4/30
Domestic Patent References:
| JP7032936U | ||||
| JP2000077260A | ||||
| JP2013098525A | ||||
| JP2019176127A | ||||
| JP2020013974A | ||||
| JP2020036001A | ||||
| JP11297566A |
Attorney, Agent or Firm:
Katayama Patent Attorneys Corporation