To provide a ceramic wiring board which can be baked by microwave heating while avoiding an increase in the relative permittivity of an insulating layer, and also a method of manufacturing the ceramic wiring board.

Internal wiring conductors 2, via hole conductors 3, and surface wiring conductors 4, 5 are made of a metal such as Ag-, Cu-, Pd-, Pt-base metal, and also contain an additive of a material having relative permittivity higher than the insulating layer. The additive has a relative permittivity of preferably 7 or higher. More specifically, as the additive or additives, one, two or more selected from the group of SiC, TiO2, ZrO2, MgO, AlN, Cr2O3, ZnO and Si3N4 having high relative permittivities can be used. Among these additives, SiC, TiO2, ZrO2, MgO, Cr2O3, and ZnO are preferable because of their high relative permittivities with less additive amount.